We have heard that AMD will solely provide DDR5 assist with the Zen 4 structure. This info has not been formally confirmed, however plainly DDR4 reminiscence is not going to be potential on the brand new platform.

Alongside AMD, motherboard producers are additionally planning to change to a brand new chip design for upcoming motherboards. The Pink group adopted a brand new design with the Zen 2 structure, the place it positioned 7nm CPU chips subsequent to the 14nm I/O hub die. Nonetheless, at this level, it’s talked about {that a} motherboard design with a twin chipset will likely be used.

AMD is working with ASMedia to design the motherboard chipsets. It appears just like the dual-chip design will solely be used on high-end X670 motherboards. In line with the knowledge acquired, each chips used within the chipset are the identical. Thus, the X670 can provide twice as many connections because the chips used within the B650. As well as, these chips will likely be produced utilizing TSMC’s 6nm course of.

In a single-chip configuration, it supplies eight PCIe 4.0 ports, 4 for PCIe 4.0 storage, the remaining cut up between SATA drives and USB ports. With the X670, this quantity will possible double, the platform’s connectivity infrastructure will likely be vastly strengthened, and plenty of connectivity alternatives will likely be offered for high-end customers.

As we’ve said many occasions earlier than, the AM5 platform will assist PCIe 5.0 connectivity expertise alongside DDR5 reminiscence. We anticipate to see the following era of Ryzen 7000 collection processors and 600 collection motherboards earlier than the top of this 12 months.

Fatih, who has been intertwined with expertise and video games from a younger age, is completely happy to conduct analysis and convey his experiences to folks.